Business Introduction
Business
세계 최고 수준의 증착전문기업 EQ Tech Plus
Deposition Wafer for Semiconductor Evaluation
Film Depostion Service
Deposition Wafer Business
Business Flow
1
Wafer Production
si wafer
2
Film Deposition service
Deposition
3
Evaluation
- - Equipment companies
- - Materials companies
- Process
-
chemical polishing
wet etching
dry etching
precursor, etc.
4
Device Manufacturing
Device
- Manufacturing Film Wafer
-
- Cost reduction
- Fast delivery
- Customization
300mm Film Wafer Specification
Film | Thickness | Spec.(%) | * | ||
---|---|---|---|---|---|
1 | Nitride | Thin | 50 ~ 500 Å | ≤ 2.0 | D |
Thick | 500 ~ 5,000 Å | ≤ 2.0 | |||
2 | Si | Amorphous | 500 ~ 10,000 Å | ≤ 2.0 | D |
Poly | 500 ~ 3,000 Å | ≤ 2.0 | |||
3 | P-TEOS | 500 ~ 40,000 Å | ≤ 5.0 | S | |
4 | P-SiON, P-SiN, P-SiO2 | 300 ~ 3,000 Å | ≤ 3.0 | S | |
5 | Termal Oxide | Thin | ≤ 100Å | ≤ 2.0 | D |
Thick | ~ 1,000Å | ≤ 2.0 | D | ||
1,000 ~ 20,000 Å | ≤ 2.0 | D | |||
6 | ACL (Amorphous Carbon Layer) | 1,000 ~ 20,000 Å | ≤ 5.0 | S | |
7 | PR( I-Line) | 1 ~ 3 ㎛ | ≤ 5.0 | S | |
8 | Annealing | ~ 850 ℃ |
※ D : Double Side Deposition S : Single Side Deposition